TEOS Trap – MKS

Low-pressure chemical vapor deposition using TEOS (tetraethylorthosilicate, Si(OC2H5)4) is a popular precursor for the deposition of silicon dioxide as an interlayer
dielectric film. The use of TEOS does create problems on the downside of the process chamber in the vacuum pump lines. TEOS and its byproducts have a propensity to clog the vacuum pump line with solid and viscous-liquid effluent byproducts. This increases particle levels, impedes gas flow, and can cause catastrophic pump failure.

The TEOS Trap, when used as one element of a TEOS Effluent Management Subsystem™, has proven very effective in reducing particulates and increasing uptime. The TEOS Trap collects TEOS byproducts, preventing them from backstreaming into the furnace and contaminating the pump. In test cases, a greater than 20% reduction in particulates has been recorded.